The Orange Waffle Cutting pad is made with the self centering system. This innovations instant centering achieves vibration free buffing with less fatigue and a better result. Our Ring Pad system does all this and more. Along with the centering benefit we have shaped the front of the pad with a Waffle design and engineered a flexible backing plate that will accept air, rotary and random orbit buffers; the waffle face will help dissipate compounds evenly, minimizing grabbing and reducing heat while the backing plate helps reduce pad stiffness. The Orange Waffle Cutting foam pad has a measured cell structure that provides a different level of cutting or finishing. Used in conjunction with your favorite buffing medium, this is the ultimate buffing solution. This Orange Waffle Foam Cutting Pad is one of the most aggressive foam cutting pads available. Developed with stronger aggressive foam allowing for the right level of correctionwhen comounding.This Orange Waffle pad is great for light to heavy oxidation removal. This orange pad is a firm high density foam pad which is designed for long durability.